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Research

Diamant

Our team is committed to promoting technology transfer, bridging fundamental research in discrete micro-nanoelectronic components with the development of complex systems. 

We leverage cutting-edge expertise in material and component characterization, micro and nanofabrication process science, as well as chip assembly and interconnection through heterogeneous 3D integration.

This advanced know-how enables us to support innovative applications in quantum electronics, neuromorphic electronics, photonic devices, and artificial intelligence technologies.

Research Themes

Advanced Microelectronic Assembly

SnAg micropillar
(a)Schematic representation of a SnAg micro-bump structure featuring the Ni cap layer; (b) Demonstration of 30 µm pitch bumps after reflow
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Lateral interconnection with 1.65 µm L/S and 3 µm thickness on an organic substrate
  • Development of innovative microfabrication processes for high-density interconnections
  • Integration of temperature and stress microsensors into multi-chip modules
  • Wafer reconstruction using molding for advanced packaging

Neuromorphic Engineering

Neuromorphic
Characterization at cryogenic temperatures (4.2 K) of TiO2-x-basedmemristors fabricated with a CMOS-compatible etch-back process.
  • Integration of emerging resistive memories on CMOS circuits
  • Development of electrical test methods and platforms
  • Hardware implementation of formal and impulse neural networks
  • Development of cryogenic neuromorphic circuits for quantum technologies

Quantum Nanoelectronics

Quantum nanoelectronics
Simulation of the co-integration of a double quantum dot and the memristor-based DC source
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Silicon nanowire array with resin cap
  • Development of Qubits on Industrial FDSOI Substrates
  • Fabrication of Qubits on Si

Emerging Memories

Emerging memories
Chip 2 packaged on chip carrier via wirebonding
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Crossbar circuit implementation
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128×128 memristor HIDATA tile array
  • Fabrication of resistive memories, also known as memristors automatic control of qubits using AI
  • Development of electronics capable of operating at cryogenic temperatures

Microelectromechanical System (MEMS)

Packaged MEMs
Packaged MEMS switch
Integration processes for photonic systems
Integration of photonic systems
  • Development of micromachining processes
  • Integration processes for photonic systems
  • Fabrication and characterization of MEMS devices