Alumni

Sopheasith Hem ( 2025) – Nanofabrication of quantum photonic circuits.
Bhagyashre Zinzuvadiya ( 2025) – Ensemble metrology of commercial spin qubits.
Basit Abdul (2025) – Development of PCM test structures for MEMS fabrication process control.
Dipti (2025) – Development of a nanofabrication platform for innovative quantum microelectronic devices.
Marwan Besrour (2025) – Design of an analog/digital platform for neuromorphic computing.
Iman Shackery ( 2025) – Development of a fabrication process for spin qubits based on SiGe.
Hussein Assaf (2024) – Design and characterization of a dedicated chip for qubit control using a machine learning circuit.
Jie Xu (2024) – Integration of 3D neuromorphic circuits for artificial intelligence.
Mohamed Najah (2023) – Molding process for high-density heterogeneous integration.
Olga Chichvarina (2021) – Development of a fabrication process for inter-chip interconnects on reconstructed wafers, memristors in CMOS BEOL, and a “mix-and-match” approach between UV and e-beam lithography.
Juliana Chawich (2021) – Modeling of laser interaction in microelectronic chip singulation.
Yang Qiu (2021) – Design and fabrication of test vehicles for evaluating silicon bridge performance.
Nizar Bouguerra (2021) – Thermal enhancement of postdoc advancement in microelectronic packaging.
Javier Arias Zapata (2020) – Development of a plasma process for integrating memristive crossbars on CMOS.
Gwenaëlle Lamri (2020) – Analog crossbar memory matrices in CMOS BEOL for neuromorphic applications.
Julien Pezard (2019) – Integration of CNT-based sensors into a microelectronic module.
Somsubhra Chakrabarti (2019) – Development of a high-density RRAM fabrication process.
Yosri Ayadi (2018) – Embedded sensors for microelectronic packaging reliability.
Bruno Lee Sang (2017) – Technological research on nanoelectronic devices integrated on CMOS.
Umar Shafique (2017) – Integration of humidity sensors into a microelectronic package.
Jeff Moussodji Moussodji (2019) – Impact of chip singulation on microelectronic package reliability.
Yann Beilliard (2017) – Design and fabrication of a 3D inductor on glass for voltage converters.
Emilie St-Jean (2016) – Development and testing of a coupling agent to improve underfilm adhesion in bumped chip packaging.
Charlotte Mallet (2015) – Study of underfill coupling agents in advanced packaging.
Patrick Wilson (2016) – Design and fabrication of a CNT-based humidity sensor to improve flipped chip manufacturing.
Benattou Sadani (2015) – Electron beam lithography for ultimate resolution and 3D integration.
Marc Guilmain (2014) – Development of an etching process for an IR imager.
Amer El Hajj Diab (2013) – Study of electronic properties of tunnel junctions for nanoelectronics.
Céline Masclaux (2014) – High-temperature lithographic masks for sacrificial layers in optical MEMS fabrication.
Mamadou Diop (2013) – Underfill issues in semiconductor packaging for large chips.
Asma Ayari-Kanoun (2013) – Lead-free challenges in semiconductor packaging for large chips.
Aurélie Lecestre (2012) – Development of SET fabrication process on CMOS circuits.
Christian Nauenheim (2013) – Fabrication and characterization of TiO₂ memristors.
Nader Jedidi (2011) – Integration of a single-electron device into CMOS technology.
Abdelkader Aliane (2011) – Microfabrication of a microcalorimeter for medical imaging applications.
Lino Eugene (2010) – Development of an advanced electron beam lithography technique.
Hendrix Demers (2011) – Monte Carlo simulation of 3D and liquid samples in STEM.
Serge Ecoffey (2012) – Fabrication of non-volatile memory based on hybrid SET-CMOS technology.
Arnaud Beaumont (2009) – Development of a CMP process for fabricating single-electron transistors at room temperature.

Juliano Nestor Borges ( 2025) – Development of plasma etching processes for thin metallic layers in high-density interconnections for advanced packaging applications.
Hafiz Waqas Ali (2025) – Low-temperature non-eutectic interconnection using SLID (Solid-Liquid Interdiffusion).
Matthieu Valdenaire ( 2025-not completed) – Study of TiO₂-based resistive memory circuits for implementing neural networks on CMOS.
Franck Sabatier (2024) – Optimization of inductance through topologies and materials for RF and quantum applications in CMOS technology.
Nikhil Garg (2024) – Learning in neuromorphic memory with nanometric-scale non-volatile memory.
Victor Yon (2024) – Development of learning strategies adapted to memristor-based neural networks for silicon quantum computing.
Raphaël Dawant (2024) – Development of a manufacturable microfabrication process for 3D integration of neuromorphic circuits in the back-end-of-line of CMOS chips.
Dorian Coffineau (2024) – Study of ferroelectric tunnel junctions based on HZO for implementation in neuromorphic circuits.
Pierre-Antoine Mouny (2024) – Co-integration of memristors and quantum dots for large-scale computing.
Benoît Manchon (2023) – Realization of ferroelectric artificial synapses for hardware implementation of neuromorphic networks.
Romain Stricher (2022) – Chemical-mechanical polishing for the fabrication of thin films of in-situ boron-doped polycrystalline silicon and their assembly by direct bonding.
Maxime Plourde (2022) – Design and fabrication of nonlinear selectors based on the tunnel effect.
Abdelouadoud El Mesoudy (2022) – Development and material-level optimization of valence-change resistive memories for in-memory computing.
Adham Elshaer (2022) – MOS hydrogen sensor and integration method with FDSOI transistor technology.
Quentin Vandier (2021) – Design of a circuit for reading temperature and humidity sensors based on carbon nanotubes integrated into microelectronic assemblies.
Abderrahim El Amrani (2020) – Development of a sequential electrodeposition process for the fabrication of high-density microbeads.
Maxime Godard (2020) – Inline plasma treatment for improving Flip-Chip encapsulation processes.
Getenet-Tesega Ayele (2019) – Development of ultra-sensitive ISFETs compatible with CMOS in the BEOL of industrial UTBB FDSOI transistors.
Vincent Lafage (2019) – Development of magnetic-core inductors for integrating a DC-DC converter on a glass interposer.
Emmanuel Tetsi (2019) – Development of thin films based on dielectric nanoparticles and optimization of deposition for manufacturing decoupling capacitors used in high-density electronic module assemblies.
Youcef Ataellah Bioud (2019) – Defect engineering related to Ge-on-Si heteroepitaxy: porous germanium-based virtual substrates for photovoltaics.
Arbi Maalaoui (2018) – Study and characterization of carbon nanotube positioning by dielectrophoresis for the fabrication of chemical sensors in liquid environments.
Mouawad Merhej (2018) – 3D integration of silicon-germanium nanowire transistors on CMOS chips.
Aurore Quelennec (2018) – Integrated sensors for improving the reliability of microelectronic encapsulation technologies.
Marina Labalette (2018) – 3D integration of complementary resistive memories in the CMOS back-end-of-line.
Yosri Ayadi (2016) – 3D integration of SET devices in the back-end-of-line of 28 nm CMOS technologies for ultra-low-power sensor development.
Bruno Lee Sang (2016) – Development of technological processes for monolithic 3D integration of nanoelectronic devices on CMOS.
Khalil El Hajjam (2016) – Tunnel junction engineering to improve the performance of metallic single-electron transistors.
Gabriel Droulers (2016) – Design and fabrication of a quantum cellular automaton based on a damascene process for metallic single-electron transistors.
Marc Guilmain (2013) – Fabrication of non-volatile single-electron memory using a floating nanogrid approach.
Mohamed Amine Bounouar (2013) – Double-gate single-electron transistors: modeling, design & evaluation of logic architectures.
Nicolas Jouvet (2012) – Hybrid integration of single-electron transistors on a CMOS technology node.
Asma Ayari-Kanoun (2011) – Fabrication and characterization of localized silicon nanocrystals made by electrochemical etching for nanoelectronic applications.
Emmanuel Dupuy (2010) – Growth and spectroscopy of diluted InAs/InP(001) quantum dots for nanophotonic applications at 1.55 µm.
Lino Eugene (2009) – Realization and optoelectronic characterization of a nanopixel based on silicon nanocrystals.
Christian Dubuc (2008) – Study and fabrication of single-electron transistors with extended operating temperature range.

Pierre Gliech (2024) – Development of a passivation process for CMOS-compatible memristors.
Patrick Dufour (2023) – Design of a learning system based on FPGA integrated on printed circuit boards for matrix-form artificial neural networks.
Philippe Drolet (2023) – Robust neural networks against machine learning variability on passive crossbars of TiO₂-based resistive memories.
Julien Devulder (2021) – Cryogenic characterization of industrial FD-SOI CMOS structures for quantum information.
Claude Rohrbacher (2019) – Cryogenic study of FD-SOI CMOS nanostructures.
Alexandre Rousseau (2019) – Copper nanowire for non-volatile memory applications controlled by electromigration.
Frédéric Brousseau (2019) – Fabrication of analog resistive memories based on TiO₂₋ₓ for neuromorphic applications.
Maxime Plourde (2018) – Fabrication of a charge detector based on a damascene metallic single-electron transistor.
Simon Landry (2017) – Fabrication and integration into an assembled module of a strain and humidity gauge based on carbon nanotubes.
Lucas Valverde (2014) – Design of switchable bipolar cells for Resistive Random Access Memory technology.
Frédéric Bourque (2014) – Design of readout circuits adapted to single-electron devices.
Jean-Philippe Richard (2013) – Fabrication of single-electron transistors for charge detection.
Damien Griveau (2013) – Implementation of the demonstrator aspect of single-electron transistors.
Patrick Harvey-Collard (2013) – Fabrication of silicon single-electron transistors for classical and quantum information processing: a nanodamascene approach.
Jean-François Morissette (2010) – Fabrication of self-aligned gate single-electron transistors using hybrid lithography and damascene process.
Franck Ky Trinh (2010) – Simulation of a neural network using SET transistors.
André-Sébastien Aubin (2007) – Beam current measurements with a Schottky device in variable pressure scanning electron microscopy (VP-SEM).
François Gaudreau (2004) – Study of optical properties of a small number of quantum dots using photoluminescence and cathodoluminescence.
Xavier Tastet (2004) – Validation of an imaging simulation model by scanning electron microscopy through the study of ultra-high-resolution semiconductor heterostructures.
Nadia Lahkak (2003) – Optical and structural characterization of InAs/InP quantum dot structures using low-energy cathodoluminescence.

Alice Demilly(Jan 2026) - Development of spraying processes and structuring of chitosan-based resins for microelectronics.
Mathieu Descombes (2025) – Characterization of MEMS micro-switches for cryogenic and quantum applications
Zeinab Kaba (2025) – Si interposer platform for quantum biomedical applications
Salomon Gondo (2025) – Hybrid bonding with polymers for microelectronics
Aude Ducauroy (2025) – Optimization of microfabrication processes for micropillars in heterogeneous integration
Jade Emmanuella Takougang Balep (2025) – Development of a bonding process for the fabrication of integrated photonic devices
Cloé Druillole (2025) – Development of bio-based polymers for advanced microelectronic assembly
Tom Thinel (2025) – Optoelectronic spin addressing
Sarra Hatla (2024) – Nanofabrication of photonic addressing structures
Adrien Aboudib (2024) – Study of Hf₀.₅Zr₀.₅O₂-based ferroelectric memories for in-memory computing in AI and quantum technologies
Guillaume Capet (2024) – Development of electronic/software systems for training memristor crossbar-based artificial neural networks
Elias Abboubi (2024) – Characterization of memristors for neural networks
Sarra Zitoun (2024) – Nanofabrication of photonic addressing structures
Houria Mbala (2024) – Building a PMV: ODMR of a µm-scale SCD on chip
William Genetelli (2023) – In-situ and real-time automatic calibration of silicon quantum dots using ultra-low-power AI algorithms
Stanislas Pastor (2023) – Development of technological building blocks for next-generation spin qubits in Si, Ge, and SiGe alloys
Yohan Finet (2023) – Impact of memristor non-idealities in crossbars for quantum dot charge state self-calibration using neural networks: an analog circuit simulation approach
Roumli Nourzat (2023) – Development of superconducting interconnects for cryogenic electronics in quantum technologies
Bastien Galaup (2023) – In-situ and real-time automatic calibration of silicon quantum dots using ultra-low-power AI algorithms
Brice Torti (2022) – Development, fabrication, and characterization of resistive memories for neuromorphic circuit applications
Arsène Guedon (2022) – Development, fabrication, and characterization of temperature and strain sensors on multi-chip electronic modules
Adrien Delpoux (2022) – Development, fabrication, and characterization of resistive memories designed for cryogenic operation in quantum technologies
Wellington De Oliveira Avelino (2021) – Development of memristor-based neuromorphic circuits and study of machine learning applications with this hardware
Julien Aubourg (2020) – Study of self-assembly of a silicon bridge for high-performance multi-chip microelectronic modules
Nikhil Garg (2020) – Development of memristor-based neuromorphic circuits and study of machine learning applications with this hardware
Thibault LeGentil (2020) – Development of a semi-additive microfabrication process for high-density interconnects on organic substrates
Joao Henrique Quintino Palhares (2020) – Fabrication and electrical characterization of TaOx/Zr-based memristors
Hussein Hamieh (2020) – Study of high-density copper interconnects on various substrates using COMSOL Multiphysics software
Yuanyan Guo (2020) – Electrical characterization of individual memristor devices and crossbar circuits for neuromorphic applications
Pierre-Vincent Guenery (2016) – Fabrication and characterization of a planar resistive memory based on hafnium oxide
Emna Farjallah (2014) – Fabrication and study of a HfO₂-based resistive random-access memory
Fabien Deprat (2013) – Modeling of 3IT electron resist formulation for high-energy electron beam lithography
Chao Lu (2013) – Qualification of TiN material in SET fabrication
Siegfried Chicot (2012) – Optimization of the lithography process for nanoelectronic devices
Thibault Labbaye (2012) – Electrical and morphological characterization of Ti nanowires
Cleo Gonnet (2012) – Optimization of the CMP process for SET fabrication
Jeremy Blanc (2011) – Migration toward a new CMP planarization system
Onoriu Puscasu (2010) – Fabrication of a single-electron transistor by CMP planarization
Jeremy Pont (2010) – Process development for SET island using negative e-beam
Bruno Lee Sang (2010) – Development of an interconnect process for SET-CMOS hybrids
Luca Incarbone (2009) – Fabrication of a nanopixel based on silicon nanocrystal materials
Pierre Markey (2008) – Characterization of TiOx formed by O₂ plasma

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